Through Hole Assembly


Whether your Through Hole Assembly manufacturing requirements are large or small, high density multilayer printed circuit boards or miniature hand-soldered assemblies, Micron has the capability to meet your exact requirements.

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Quality Manual

Quality Assurance
View our Quality Assurance Manual online. See exactly how we perform every operation of the Through Hole Assembly Process.
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Or download a pdf version of our Quality Assurance Manual.
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Wave Soldering

through_hole_assembly_waveWave Soldering System
Our advanced design Wave Soldering System.
Fully equipped with every feature for multi-layer fine line printed circuit board soldering.
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Assembly Line

No matter your requirements our Through Hole Assembly Line has the capabilities to manufacture your printed circuit boards with excellent quality. READ MORE >>


Wave Soldering System

When Through Hole Soldering is required our advanced Wave Soldering System is able to achieve a maximum degree of solder quality. READ MORE >>



All Through Hole Assemblies undergo extensive cleaning at several critical points during the assembly process and especially after wave soldering. READ MORE >>

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