EMS - Micron Corp.

Your New England Partner for High-Reliability Builds

We focus on SMT and through-hole assemblies, NPI/prototypes, and low-volume production with the responsiveness only a local EMS can provide. Our process discipline—profiling, AOI/X-ray, documentation, and traceability—keeps programs on schedule and compliant with IPC-A-610 and J-STD-001.

Capabilities

SMT Assembly

01005, fine-pitch QFN/BGA, profile-tuned reflow, 3D AOI & X-ray verification.

Through-Hole Assembly

Selective hand solder; wave/drag partners; conformal coat & potting as specified.

Prototypes & NPI

Risk-reduction runs, DFM feedback, quick-turn builds, EVT/DVT support.

Box Build / Electro-Mechanical

Harnessing, enclosure integration, labeling, packaging, and test.

Test & Programming

ICT/functional test, fixture coordination, firmware loading, and recordkeeping.

Supply Chain Support

BOM scrubs, AVL alignment, alternates, turnkey or consigned kits, lifecycle guidance.

Industries We Serve

Aerospace / Defense

Ruggedized designs, documentation discipline, export-aware workflows.

Medical

Cleanliness controls, traceability, and record retention per customer SOPs.

Industrial

Low-volume production with revision control and ECO responsiveness.

R&D / Labs

Quick-turn prototypes, EVT/DVT/PVT pilots, and bring-up support.

Quality, Documentation & Compliance

Builds to IPC-A-610 and J-STD-001 (Class 2/3 per spec)
ESD controls, lot traceability on request, traveler/route compliance
First Article, AOI/X-ray reports, reflow profiles archived per program
Customer-specific labeling, serialization, and acceptance criteria

Key Equipment

Process control that scales from proto to production.

SpeedPrint SP710 — Printing

Twin roving cameras; precise stencil-to-PCB alignment and consistent paste volume.

Mycronic MY300 & MY200 — Placement

High-res vision to 0.15 mm; throughput + accuracy for QFN/BGA/01005.

Heller 1707 MKIII — Reflow

Stable multi-zone profiles; robust solder joints and low voiding.

Mirtec MV-6 Omni — 3D AOI

3D Moiré, telecentric optics; verifies 01005 & hidden joints.

See our upgrades: Micron upgrades SMT assembly lines.

Our Process

DFM & Launch

BOM scrub, stencil/aperture strategy, panelization, build plan & traveler.

Assembly

Profile-tuned reflow; SMT + through-hole; certified rework as needed.

Verification

3D AOI, X-ray as required, ICT/functional test per spec, documented results.

FAQ

What files should I include for a quote?

BOM (alternates), Gerbers/ODB++, PnP/Centroid, assembly drawings, test requirements, target quantities & schedule.

Do you build to IPC-A-610 / J-STD-001 Class 2 or 3?

Yes—Class 2 or Class 3 as called out. We archive profiles and inspection reports per program.

Typical prototype lead time?

Often 5–10 business days after kit completeness and stencil receipt; materials can be turnkey or consigned.

Can you provide a turnkey quote if we don’t have materials?

Yes. Provide your BOM and quantities—our sourcing team can identify alternates, check availability, and provide a complete turnkey cost that includes materials, assembly, and test.

What component lead times do you typically see?

Passive and discrete parts are often available within days, but specialty ICs or long-lead items can vary by 8–20 weeks. We monitor lead-time trends and can suggest alternates early in the quoting stage.

Do you support customer-supplied (consigned) kits?

Absolutely. We handle consigned, partial, or hybrid kits. Our receiving process verifies line items against your BOM to ensure all components are present before scheduling assembly.

Can Micron help with design-for-manufacturability (DFM)?

Yes. Our engineering team reviews your BOM, Gerbers, and assembly data to flag potential issues such as solder mask clearance, via-in-pad, stencil design, and thermal relief recommendations.

What quality certifications do you follow?

All assemblies follow IPC-A-610 and J-STD-001 standards. Our processes align with ISO 9001 quality principles, and we maintain full ESD control per ANSI/ESD S20.20 guidelines.

Do you offer conformal coating or potting?

Yes—through approved partners and in-house masking and inspection. We handle silicone, acrylic, and urethane coatings per MIL-I-46058C and IPC-CC-830 requirements.

How do you ensure ESD protection during assembly?

Our production floor uses static-dissipative flooring, grounded benches, wrist straps, ESD packaging, and continuous monitoring to protect sensitive components.

Do you store leftover components after a build?

Yes—remaining components are returned or held in secure, climate-controlled storage per your instructions. We can retain reels for future repeat builds.

Can Micron handle box-build or mechanical integration?

Yes, we routinely integrate electronics into final enclosures, wire harnesses, and subassemblies—including labeling, packaging, and system-level testing.

Do you manage firmware programming and functional test?

We can load firmware, perform functional and in-circuit testing, and coordinate with your engineering team to validate units prior to shipment.

Where are your assemblies produced?

All production occurs at our Norwood, Massachusetts facility—fully equipped for SMT and through-hole builds with Mycronic placement and Mirtec inspection systems.

Request a Quote

Attach BOM, Gerbers, assembly drawings, and any special process notes. We’ll respond within one business day.