Electronic Manufacturing Services

High-reliability EMS for high-mix, low-volume builds.

Micron supports SMT, Through Hole, Prototypes, NPI, test, programming, and production builds from Norwood, Massachusetts — with the responsiveness of a local New England manufacturing partner.

Since 1982 Norwood, MA IPC-A-610 / J-STD-001 Class 2/3

Micron is built for customers who need reliable electronics manufacturing without offshore distance, bloated handoffs, or unclear production status. The EMS program focuses on the details buyers care about most: scope clarity, build discipline, inspection, documentation, and speed to a usable quote.

EMS overview

Your New England partner for reliable electronics builds.

Micron focuses on SMT and Through Hole assemblies, NPI and Prototypes, and low-volume, high-mix production. The goal is simple: help OEM teams move from design data to a controlled build with fewer assumptions and clearer communication.

For programs that require inspection records, traceability, revision control, and customer-specific documentation, Micron combines manufacturing discipline with a local team that can respond quickly when details change.

EMS intake BOM Gerbers
A clear EMS program starts with usable design files, reviewable build assumptions, documented process controls, and a practical handoff from quote to production.
01

Local responsiveness

Engineering, sourcing, and production questions can be handled directly with the team building the assembly.

02

High-mix discipline

Processes are structured for prototypes, NPI, pilots, and recurring low-volume production where change control matters.

03

Controlled documentation

Inspection, test, revision, traveler, labeling, and traceability requirements can be aligned before the build begins.

Capabilities

Built around the complete assembly path.

Micron’s EMS offering covers the major steps required to move from board data to assembled, inspected, and documented product.

Key equipment

Process control that scales from prototype to production.

Micron’s equipment set supports the connected manufacturing path from solder paste printing through placement, reflow, and inspection.

SpeedPrint SP710 stencil printer
Print

SpeedPrint SP710 – Printing

Twin roving cameras support precise stencil-to-PCB alignment and consistent paste volume.

Mycronic MY300 and MY200 pick-and-place equipment
Place

Mycronic MY300 & MY200 – Placement

High-resolution vision supports accuracy for QFN, BGA, and 01005 assemblies.

Heller 1707 MKIII reflow oven
Reflow

Heller 1707 MKIII – Reflow

Stable multi-zone profiles support robust solder joints and low voiding.

Mirtec MV-6 Omni 3D AOI system
AOI

Mirtec MV-6 Omni – 3D AOI

3D Moiré and telecentric optics help verify 01005 components and hidden joints.

Industries served

Manufacturing support for programs where reliability matters.

Micron’s strongest fit is work that benefits from clear documentation, change control, inspection discipline, and local communication.

AD

Aerospace / Defense

Ruggedized designs, documentation discipline, and export-aware workflows.

MED

Medical

Cleanliness controls, traceability, and record retention aligned to customer SOPs.

IND

Industrial

Low-volume production with revision control, ECO responsiveness, and dependable repeat builds.

R&D

R&D / Labs

Quick-turn prototypes, EVT/DVT/PVT pilots, bring-up support, and design feedback.

Quality, documentation & compliance

Process control for builds that need evidence, not guesses.

When assemblies require documented acceptance criteria, inspection records, or traceability, the production process needs to be planned before the first board is built.

Quality framework

From standard requirements to customer-specific records.

Micron supports build requirements such as IPC-A-610 and J-STD-001 Class 2 or Class 3 as specified, ESD controls, lot traceability on request, traveler and route compliance, AOI/X-ray reports, archived reflow profiles, customer labeling, serialization, and acceptance criteria.

01RequirementsConfirm class, revision, documentation, labeling, and inspection needs.
02ESD controlsUse controlled handling, packaging, benches, flooring, and production safeguards.
03Build recordsAlign traveler, route, process steps, lot traceability, and special instructions.
04InspectionUse first article, AOI, X-ray, and reflow profile records as the program requires.
05AcceptanceValidate to customer-specific pass/fail criteria, reports, and shipping needs.

Our process

A clearer path from quote to documented shipment.

Customers are not only buying component placement. They are buying a controlled path from design data to a build they can release, test, and repeat.

DFM BOM, stencil, panel Launch Traveler, route, plan Assembly SMT + Through Hole Verify AOI, X-ray, test Ship Records
DFM, launch planning, assembly, verification, and documentation are presented as one connected production path.
DFM & LaunchBOM scrub, stencil strategy, panelization, build plan, and traveler preparation.
AssemblyProfile-tuned reflow, SMT and Through Hole, and certified rework as needed.
Verification3D AOI, X-ray as required, ICT or functional test per spec, and documented results.
Production supportRevision control, repeat-build readiness, packaging, labeling, and handoff notes.

FAQ

Questions customers ask before sending an RFQ.

These answers clarify the files, build assumptions, quality requirements, and quoting details that help an RFQ move faster.

What files should I include for a quote?

Include a BOM with alternates, Gerbers or ODB++, pick-and-place or centroid data, assembly drawings, test requirements, target quantities, and schedule goals.

Do you build to IPC-A-610 / J-STD-001 Class 2 or Class 3?

Yes. Class 2 or Class 3 can be supported as called out in the program requirements. Profiles and inspection reports can be archived per program.

What is a typical prototype lead time?

Prototype timing depends on kit completeness, stencil receipt, material availability, and test requirements. Many prototype builds are often 5-10 business days after kit completeness and stencil receipt.

Can Micron provide a turnkey quote?

Yes. Provide the BOM and quantities so sourcing can identify alternates, check availability, and quote materials, assembly, and test scope.

Do you support customer-supplied kits?

Yes. Consigned, partial, and hybrid kits can be supported. Receiving should verify line items against the BOM before scheduling assembly.

Can Micron help with DFM?

Yes. Engineering can review BOM, Gerbers, and assembly data to flag issues such as solder mask clearance, via-in-pad, stencil design, or thermal relief concerns.

Do you handle box-build or mechanical integration?

Yes. Micron can integrate electronics into enclosures, wire harnesses, and subassemblies, including labeling, packaging, and system-level testing.

Request a quote

Send the build package you have.

Attach the core files and explain what is still changing. The clearer the input package is, the faster Micron can evaluate scope, materials, assembly, test, and schedule.

For a faster review, include:

BOMManufacturer part numbers, alternates, quantities, and revision level.
PCB dataGerbers or ODB++, pick-and-place data, and assembly drawings.
Build contextQuantities, schedule, turnkey or consigned model, and special processes.
Test detailsFunctional test, ICT, programming, fixtures, serialization, and reports.
Phone(781) 949-3500 Emailsales@microncorp.com

Start the RFQ conversation

A strong RFQ does not need to be perfect. Share the files and context available today, and Micron can help identify the manufacturing, sourcing, inspection, and test details needed for a cleaner estimate.

Assembly details: SMT, Through Hole, mixed-technology, box-build, or electromechanical scope; RoHS or leaded requirements; and target quantities. Build files: BOM, Gerbers or ODB++, pick-and-place data, assembly drawings, test notes, firmware requirements, and critical components. Project context: Prototype, pilot, or production timing; turnkey or consigned material preference; quality records; labeling; and special processes.
The earlier these details are shared, the easier it is to flag material risk, DFM concerns, test assumptions, and schedule constraints before the build reaches the floor.

RFQ formUse the form here to send project details, build files, quantities, and schedule goals. If the form is unavailable, email sales@microncorp.com.

  • This field is for validation purposes and should be left unchanged.
  • This field is hidden when viewing the form
  • Qty 1Qty 2Qty 3 
  • This field is hidden when viewing the form
    Max. file size: 2 MB.
  • Drop files here or
    Max. file size: 2 MB.

    Ready to start your build?

    Send your BOM, Gerbers, assembly drawings, quantities, test notes, programming requirements, and schedule goals. Micron can review the package and help identify the clearest path from design data to reliable assembly.

    EMAIL OR CALL US
    (781) 949-3500