Electromechanical Assembly & Box Build
Micron Corporation integrates electronics into final enclosures with wiring & harnessing, labeling, verification, and pack-out—delivering line-ready product from our Norwood, MA facility.
From Boards to Finished Goods
We combine SMT/Through Hole expertise with mechanical integration to build sub-assemblies and complete products. Our team routes and secures wiring, applies labels and documentation, performs functional test and burn-in, and packs units to your distribution spec.
Electromechanical Sub-Assemblies

Modular Builds
Standoffs, fans, heatsinks, connectors, switches, displays, brackets, and cable management—produced as modules to streamline final integration.
Documentation & Traceability
Routers/travelers, torque specs, label maps, and as-built records maintained for repeatability and quality audits.
Wiring & Harnessing

Terminations & Protection
Cut/strip/crimp, IDC and soldered terminations; braid, sleeve, and heat-shrink; strain-relief and tie-down per drawing/BOM.
Continuity & HiPot
In-line checks, end-of-line continuity, and HiPot testing as specified; serialized records available on request.
Enclosure Integration & Labeling

Mechanical Integration
Metal/plastic enclosures, gaskets, grommets, fasteners, EMI/RFI materials, fan trays, and cable management with torque verification.
Labels & Pack-Out
Safety/agency labels, serialization/barcodes, documentation packs, custom foam/inserts, accessories, and finished-goods packaging.
Quality, Documentation & Compliance
- Builds to IPC-A-610 and J-STD-001 (Class 2/3 per specification)
- ESD controls, traveler compliance, optional lot traceability and serialization
- Functional test/burn-in per spec; AOI/X-ray data available from PCBA stage
- Customer-specific labeling, acceptance criteria, and records retention
Our Box Build Process
Kickoff & DFM
BOM & drawings review, wiring lists, test spec, packaging, label maps, and manufacturability improvements.
Sub-Assembly & Integration
PCBA + mechanicals, harness prep, torque checks, cable management, labels, and documentation.
Test & Pack-Out
Power-up, functional test, firmware load, calibration, environmental run-in, and finished-goods packaging.
Request a Quote
Attach BOM, drawings, wiring lists, and any enclosure, test, or pack-out requirements. We’ll respond within one business day.




Since 1982 • Norwood, MA • IPC-A-610 / J-STD-001 (Class 2/3)

