Electromechanical Assembly & Box Build

Micron Corporation integrates electronics into final enclosures with wiring & harnessing, labeling, verification, and pack-out—delivering line-ready product from our Norwood, MA facility.

From Boards to Finished Goods

We combine SMT/Through Hole expertise with mechanical integration to build sub-assemblies and complete products. Our team routes and secures wiring, applies labels and documentation, performs functional test and burn-in, and packs units to your distribution spec.

Electromechanical Sub-Assemblies

Electromechanical Assembly Micron Corp

Modular Builds

Standoffs, fans, heatsinks, connectors, switches, displays, brackets, and cable management—produced as modules to streamline final integration.

Documentation & Traceability

Routers/travelers, torque specs, label maps, and as-built records maintained for repeatability and quality audits.

Wiring & Harnessing

Wiring Harness Assembly Micron Corp

Terminations & Protection

Cut/strip/crimp, IDC and soldered terminations; braid, sleeve, and heat-shrink; strain-relief and tie-down per drawing/BOM.

Continuity & HiPot

In-line checks, end-of-line continuity, and HiPot testing as specified; serialized records available on request.

Enclosure Integration & Labeling

Final Enclosure Assembly Label Application Micron Corp

Mechanical Integration

Metal/plastic enclosures, gaskets, grommets, fasteners, EMI/RFI materials, fan trays, and cable management with torque verification.

Labels & Pack-Out

Safety/agency labels, serialization/barcodes, documentation packs, custom foam/inserts, accessories, and finished-goods packaging.

Quality, Documentation & Compliance

  • Builds to IPC-A-610 and J-STD-001 (Class 2/3 per specification)
  • ESD controls, traveler compliance, optional lot traceability and serialization
  • Functional test/burn-in per spec; AOI/X-ray data available from PCBA stage
  • Customer-specific labeling, acceptance criteria, and records retention

Our Box Build Process

Kickoff & DFM

BOM & drawings review, wiring lists, test spec, packaging, label maps, and manufacturability improvements.

Sub-Assembly & Integration

PCBA + mechanicals, harness prep, torque checks, cable management, labels, and documentation.

Test & Pack-Out

Power-up, functional test, firmware load, calibration, environmental run-in, and finished-goods packaging.

Request a Quote

Attach BOM, drawings, wiring lists, and any enclosure, test, or pack-out requirements. We’ll respond within one business day.

  • This field is for validation purposes and should be left unchanged.
  • This field is hidden when viewing the form
  • This field is hidden when viewing the form
    Max. file size: 32 MB.
  • Drop files here or
    Max. file size: 32 MB.

    IPC Member
    ITAR
    CE
    BBB

    Since 1982 • Norwood, MA • IPC-A-610 / J-STD-001 (Class 2/3)

    Start Your Build

    EMAIL OR CALL US
    (781) 949-3500