SMT Assembly — Precision at the Micron Level
New England EMS since 1982. Prototypes, NPI, and Production Builds to IPC-A-610 / J-STD-001
• Aerospace/Defense
• Medical
• Industrial
• R&D Prototyping
• Low-Volume High-Reliability
• Medical
• Industrial
• R&D Prototyping
• Low-Volume High-Reliability
High-Mix, Low-Volume Specialists
Turnkey or consigned. Risk-reduction runs and rapid prototypes that de-risk production.
Modern SMT Line
Mycronic MY300 pick-and-place, fine-pitch/QFN/BGA, reflow profiling for low voiding on thermal pads.
Quality Built-In
3D AOI + X-ray inspection, ESD controls, builds to IPC-A-610 / J-STD-001 Class 2/3.
Engineering & DFM
Stencil/aperture strategy, panelization, BOM scrubs, and supply options to keep you on schedule.
Rapid Turnaround
Prototypes in days, not weeks. Optimized workflow and component sourcing for speed and accuracy.
Complete EMS Integration
Seamless transition from SMT to through-hole, box build, and test for a true turnkey experience.
Process Control That Scales from Proto to Production
- Printing: SpeedPrint SP710 with twin roving cameras for precise alignment and consistent paste deposition.
- Placement: Mycronic MY300 SX-15 & MY200 LX-14 for fine-pitch/QFN/micro-BGA with high throughput.
- Reflow: Heller 1707 MKIII for uniform thermal profiles and reliable solder joints.
- Inspection: Mirtec MV-6 Omni 3D Moiré + multi-angle projection for 01005 and solder-joint quality.
- Traceability & Rework: AOI/X-ray records, profile data, and certified rework available on request.
Built for High-Reliability Applications
Aerospace/Defense: ruggedized designs, documentation discipline
Medical: traceability and cleanliness controls
Industrial: NPI to pilot to scaled low-volume
R&D: quick-turn prototypes and EVT builds
Request a Quote
Attach BOM, Gerbers, assembly drawings, and any special process notes. We’ll respond within one business day.
SMT FAQ
What files do you need for SMT quoting?
BOM (with approved alternates), Gerbers/ODB++, pick-and-place (Centroid), assembly drawings, test/ICT notes, quantities, target dates, and special processes (underfill, coating, cleaning, no-clean).
Which file formats for Centroid / pick-and-place are preferred?
CSV or TXT with at least: RefDes, X, Y, Rotation, Side (Top/Bottom), and Package. Please specify units (mm or mils) and the coordinate datum.
What stencil guidance do you recommend (apertures, thickness, step-downs)?
Common thickness is 4–5 mil stainless for mixed-tech designs; reduce apertures 5–10% for fine-pitch/QFN to control paste volume. Step-downs or windowpane apertures help QFN/BGA thermal pads to reduce voiding. We’ll advise during DFM.
Can you place 01005 and micro-BGA?
Yes. Our Mycronic line supports 01005. We use high-resolution vision, tuned profiles, and verify with 3D AOI; X-ray is used for BGAs and hidden joints.
How do you control reflow quality and voiding on QFNs/BGAs?
Profile tuning per paste datasheet, optimized aperture design (windowpane), and soak/reflow adjustments. We review X-ray where applicable and iterate profiles to hit target voiding levels when specified.
What PCB finishes work best for fine-pitch?
ENIG and ENEPIG are most stable for fine-pitch and BGA. OSP and Immersion Silver are acceptable with proper storage/handling; note shelf life and oxidation risk.
Lead-free vs. leaded?
We build both. Default is lead-free SAC305. If you require Sn63/Pb37 or mixed technology, call it out in the BOM/notes and we’ll provide specific profiles and segregation.
Do you offer cleaning or strictly no-clean?
Default is no-clean flux/paste. We can perform aqueous or semi-aqueous cleaning per spec and provide ionic contamination testing when requested.
What are your panelization and fiducial requirements?
Rails of 8–10 mm on at least two sides, three global fiducials (1 mm copper with mask clearance) and local fiducials for fine-pitch as needed. Please include tooling holes in rails for handling.
Board size and thickness limits?
Typical single PCB up to ~450 mm × 350 mm. Common thickness 1.6 mm; thinner boards (≤1.0 mm) may need extra supports. Share outliers early so we can plan fixtures.
MSL handling and baking of moisture-sensitive parts?
We follow JEDEC MSL handling. If reels/trays are out of floor life or humidity card indicates exposure, we bake per component datasheet and record the bake.
First Article (FAI) and inspection reporting?
We can provide FAI results, AOI images, X-ray captures for BGAs/QFNs, and reflow profiles. Add reporting requirements in your PO or quote notes.
Can you rework BGAs or fine-pitch ICs?
Yes. We perform controlled rework with profiled hot-air/IR stations and X-ray verification. Reballing can be arranged via approved partners if required.
Do you support conformal coating and potting?
Yes—masking, coating (acrylic/silicone/urethane), and inspection per your spec; potting/encapsulation available on request.
RoHS/REACH and material compliance?
We build RoHS and non-RoHS per customer spec. On turnkey builds we select compliant materials and can supply COC/CMRT/REACH declarations when requested.
What’s a typical prototype lead time?
Often 5–10 business days after kit completeness and stencil receipt. Turnkey timing depends on component availability; we’ll provide options/alternates.
Can you work from customer-supplied kits?
Yes—consigned, partial, or hybrid kits are welcome. We verify receipts against the BOM and flag shortages or mismatches before production.
How should I package boards and parts for shipment?
Use ESD-safe packaging for PCBs and components, include packing list/BOM, and label reels/trays with MPN, lot/date code, and quantity. Separate top/bottom side parts if possible.
Do you provide test and programming?
Yes—ICT/functional test, fixture coordination, firmware loading, and basic bring-up. Include test procedures, acceptance criteria, and any licensing keys or tooling.
What happens if an issue is found during build?
We pause, document the nonconformance, and contact you with photos/notes and a recommended disposition (rework, use-as-is with waiver, or hold pending ECO).
Since 1982 • Norwood, MA • IPC-A-610 / J-STD-001 (Class 2/3)