Surface Mount Technology (SMT) Assembly at Micron

At Micron, our SMT Assembly capabilities are the cornerstone of our precision electronics manufacturing services. We combine cutting-edge machinery, expert technicians, and rigorous quality control to deliver high-reliability PCB assemblies for OEMs across a wide range of industries.

Why Choose Micron for SMT Assembly?

• State-of-the-Art Equipment: We use advanced Mycronic MY300 and MY200 pick-and-place systems, SpeedPrint SP710 for stencil printing, and Heller 1707 MKIII reflow ovens for consistent thermal profiling.
• Experienced Team: Our team of trained specialists ensures every board is handled with care and built to your specifications.
• Fast Turnaround: From prototype to production, we deliver quality assemblies on time.
• Full-Service Capabilities: We offer complete services from PCB programming to packaging and shipping.
• Certified Quality: We are ISO 9001 compliant and follow IPC standards to ensure quality at every stage.

Our SMT Assembly Process

1. PCB Programming & Kitting: BOM validation, part verification, and machine programming
2. Stencil Printing: High-resolution SpeedPrint SP710 printer with 1μm accuracy and 2D/3D solder inspection
3. Pick & Place: Mycronic MY300 and MY200 systems with 4K vision place up to 24,000 components per hour
4. Reflow Soldering: Heller 1707 MKIII multi-zone convection reflow ovens ensure proper solder joint formation
5. Automated Optical Inspection (AOI): In-line Mirtec MV-6 AOI checks for component placement, polarity, and solder integrity
6. Manual Touch-Up & Secondary Operations: Skilled technicians handle fine-pitch, BGA, or specialty assembly tasks as needed
7. Final Inspection & Testing: Every assembly is visually and electrically tested with complete documentation
8. Packaging & Shipping: Anti-static packaging, barcoding, and serialization to meet your exact logistics needs

Our Equipment in Action